Rumored LG G3 Prime (F460S) Spotted in Bluetooth SIG filling.

in News on - 1 Comment by LGfan

We have already seen the Upgraded LG G3 (a Possible G3 Prime with Snapdragon 805 chipset) appear in an RRA ( South Korea’s version of the FCC)filing and today, it looks like the handset has made an appearance with the Bluetooth Special Interest Group (SIG). The filing shows the model listed as being the LG-F460S and as we often see here, there wasn’t much revealed in terms of specifics.


According to our sources, The Rumored LG G3 Prime (F460L,F460K and F460S) will pack snapdragon 805 (APQ8084) chipset. It means that the new handset will have a quad core Krait 450 CPU,Adreno 420 GPU, MDM9635 Modem and support for LP-DDR3 memory


More over, The F460L,F460K and F460S has been listed as LG G3 in a leaked LG Repair Manual. According to our tipser, The new device will also feature a 5.5-inch 2560×1440 pixels display and offers a pixel density of 640ppi (As same as the G3 F400).

It is reported that the LG G3 Prime with Snapdragon 805 chipset will be available in South Korea market Only! There are no hints that LG will launch G3 Prime vairnats in other countries!

Stay Tuned!